Browsing Theses by Subject "Thermosonic wire bonding"
Now showing items 1-2 of 2
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A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials
(University of Waterloo, 2010-04-30)Thermosonic ball bonding is the most popular method used to create electrical interconnects between integrated circuits (ICs) and substrates in the microelectronics industry. Traditionally gold (Au) wire is used, however ... -
A Study on the Effect of Bond Stress and Process Temperature on Palladium Coated Silver Wire Bonds on Aluminum Metallization
(University of Waterloo, 2015-09-29)In the past ten years, the increasing price of gold has motivated the wire bonding industry to look for alternative bonding wire materials in the field of microelectronics packaging. A new candidate wire to replace gold ...