Browsing Mechanical and Mechatronics Engineering by Subject "Ball bonding"
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A Study of the Electrical Flame Off Process During Thermosonic Wire Bonding with Novel Wire Materials
(University of Waterloo, 2010-04-30)Thermosonic ball bonding is the most popular method used to create electrical interconnects between integrated circuits (ICs) and substrates in the microelectronics industry. Traditionally gold (Au) wire is used, however ...