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Browsing Mechanical and Mechatronics Engineering by Subject "pad resistance"
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Novel Methods in Ball Bond Reliability Using In-Situ Sensing and On-Chip Microheaters
(University of Waterloo, 2013-01-18)Wire bonding is the process of creating interconnects between the circuitry on a microchip and PCB boards or substrates so that the microchip can interact with the outside world. The materials and techniques used in this ...